电阻浆料用导电填料的研究现状分析及展望  

Research Status and Development of the Conductive Fillers Used in Resistance Paste

作　　者：朱华 刘树信[1] 何登良[1] 谭春勇 钟斐翰 李扬 谭仁德 Zhu Hua;Liu Shuxin;He Dengliang;Tan Chunyong;Zhong Feihan;Li Yang;Tan Rende(School of Chemistry and Chemical Engineering,Mianyang Teacher’s College,Mianyang 621000,China;Deyang Congyuan Optoelectronic Technology Co.,Ltd.,Deyang 618000,China)

机构地区：[1]绵阳师范学院化学与化学工程学院,四川绵阳621000 [2]德阳聪源光电科技股份有限公司,四川德阳618000

出　　处：《山东化工》2020年第23期65-67,共3页Shandong Chemical Industry

基　　金：四川省科技厅重点研发项目(2019YFG0516);绵阳师范学院项目(MYSY2018T007、QD2020A01)。

摘　　要：作为一种应用前景广阔的电子浆料,电阻浆料近年来发展迅速,以国内外电阻浆料研究为基础,分析了导电填料(金属、石墨、炭黑、碳纳米管、碳纤维、生物炭、石墨烯、石墨烯复合导电填料)的研究现状,并对其发展趋势进行了展望,从而为电阻浆料的研发和生产提供参考。As a kind of electronic pastes with wide application prospects,the resistance paste has developed rapidly in recent years.The research status of the conductive fillers were analyzed based on the domestic and foreign study of the conductive fillers including of metal,graphite,carbon black,carbon nanotubes,carbon fiber,biochar,graphene and graphene composite conductive filler,and so on,it would provide reference for the research development and production of resistance paste.

关 键 词：电阻浆料 导电填料 现状 展望 

分 类 号：TM24[一般工业技术—材料科学与工程]