In基钎料低温钎焊界面组织与性能研究  

Microstructure and properties of In-based solder joint interface at low temperature

作　　者：宋洋 崔洪波[1] 刘波[1] SONG Yang;CUI Hongbo;LIU Bo(China Electronic Technology Group Cooperation No.55 Institute,Nanjing 210001,China)

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210001

出　　处：《电子元件与材料》2021年第1期105-110,共6页Electronic Components And Materials

基　　金：中央军委装备发展部电子元器件科研项目(1807WW0011)。

摘　　要：军用高可靠电子器件的组装工艺复杂性要求开发适用于低温钎焊的钎料。对InSnPb和InSnPbAu钎料在Cu/Ni/Au体系钎焊界面进行研究。利用DSC、SEM对钎料热性能和焊点界面显微组织进行检测,并进行剪切强度测试。结果表明,焊点金属间化合物为AuIn2。两种钎料剪切强度均满足军用标准,InSnPb略高于InSnPbAu。经过高温老化后由于原子扩散和IMC层的继续生长使焊点剪切强度略有提升,而经过温度循环后剪切强度显著下降。剪切断口形貌表明,断裂位置主要位于钎料处,对于提升塑性变形能力是有利的。厚金界面(2~3 μm)更利于提升焊接强度且不会引起"金脆"。The complex assembly of military electronic devices with high reliability requires the development of solders suitable for low temperature brazing.InSnPb and InSnPbAu solder joints(Cu/Ni/Au)were analyzed.The thermal properties and microstructures of InSnPb and InSnPbAu were investigated by DSC and SEM.The shear mechanics performance was tested after brazing aging and temperature cycling.The results show that the IMCs of solder joints are AuIn2.The shear strength of the two solders meet the military standard,and the InSnPb solder joint exhibits slightly higher strength than InSnPbAu after brazing.After aging at high temperature,the shear strength increases due to atomic diffusion and the generation of IMC.While the shear strength decreases dramatically after temperature cycling.The shear fracture morphology indicates that the fracture is mainly located in solders,which could be attributed to the plastic deformation.Thicker gold plating(2-3μm)could improve the joint strength and will not cause‘gold brittleness’behaviors.

关 键 词：军用高可靠 In基钎料 显微组织 金属间化合物 剪切强度 断口形貌 

分 类 号：TN305.94[电子电信—物理电子学]