复配固化剂对环氧树脂体系特性影响的分子动力学模拟  

Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System

作　　者：郝留成[1] 袁端鹏 陈蕊 张子扬 赵玉顺[2] 谢庆[3] 王波[4] 宋忠孝[4] HAO Liucheng;YUAN Duanpeng;CHEN Rui;ZHANG Ziyang;ZHAO Yushun;XIE Qing;WANG Bo;SONG Zhongxiao(High Voltage Switchgear Insulating Materials Laboratory of State Grid,Pinggao Group Co.,Ltd.,Pingdingshan 467001,China;School of Electrical Engineering and Automation,Hefei University of Technology,Hefei 230009,China;State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources,North China Electric Power University,Baoding 071003,China;State Key Laboratory for Mechanical Behavior of Materials,Xi'an Jiaotong University,Xi'an 710049,China)

机构地区：[1]平高集团有限公司国家电网公司高压开关设备绝缘材料实验室,河南平顶山467001 [2]合肥工业大学电气与自动化工程学院,安徽合肥230009 [3]华北电力大学新能源电力系统国家重点实验室,河北保定071003 [4]西安交通大学金属材料强度国家重点实验室,陕西西安710049

出　　处：《绝缘材料》2021年第1期73-77,共5页Insulating Materials

基　　金：国家重点研发计划项目(2017YFB0903800、2017YFB0903803)。

摘　　要：为探究复配酸酐固化剂对环氧树脂固化产物的影响,采用分子动力学方法建立了甲基四氢苯酐(MTHPA)/邻苯二甲酸酐(PA)(复配比分别为10∶0、9∶1、7∶3、5∶5、0∶10)和双酚A型缩水甘油醚(DGEBA)的交联模型,研究了在同一交联度下固化剂不同复配比对交联环氧树脂结构、热学性能和力学性能的影响。结果表明:当MTHPA和PA复配比为10∶0时,体系的自由体积占比最大,分子链段运动能力最强;复配比为7∶3时,体系的综合力学性能最好;而当复配比为9∶1时,体系的玻璃化转变温度最高,复配比为7∶3时最低。In order to explore the effect of compound anhydride curing agent on the cured product of epoxy resin,we built crosslinking models of methyl tetrahydrophthalic anhydride(MTHPA)/phthalic anhydride(PA)(their compounding ratio was 10:0,9:1,7:3,5:5,0:10,respectively)and bisphenol A-type glycidyl ether(DGEBA)by molecular dynamics method.The effect of different compounding ratios on the structure,thermal properties,and mechanical properties of the crosslinking epoxy resin with the same crosslinking degree was studied.The results show that when the compounding ratio of MTHPA and PA is 10:0,the free volume proportion of system reaches maximum,and the motion ability of molecular chains is the strongest.When the compounding ratio is 7:3,the comprehensive mechanical properties of system reach the maximum.When the compounding ratio is 9:1 and 7:3,the glass transition temperature of system reaches the highest and the lowest,respectively.

关 键 词：环氧树脂 酸酐固化剂 力学性能 玻璃化转变温度 分子模拟 

分 类 号：TM.215[电气工程]