现代镀覆技术 第三部分──化学镀铜  

Modern plating technologies:Part Ⅲ—Electroless copper plating:mechanism,application,and bath composition

作　　者：唐春华 TANG Chunhua(Quanzhou Chuangda Metal Surface Treatment Co.,Ltd.,Quanzhou 362000,China)

机构地区：[1]泉州市创达表面处理公司,福建泉州362000

出　　处：《电镀与涂饰》2021年第1期24-29,共6页Electroplating & Finishing

摘　　要：阐述了化学镀铜的反应机理,介绍了化学镀铜在制作线路板、钢铁件打底、化学镀镍封孔等方面的应用,总结了镀液中各种成分的作用。The reaction mechanism of electroless copper plating was described.The application of electroless copper plating in manufacturing of printed circuit boards,striking on iron and steel parts,sealing of electrolessly plated nickel coatings,etc.were introduced.The role of individual component in electroless copper plating bath was summarized.

关 键 词：化学镀铜 机理 应用 镀液组成 

分 类 号：TQ153.2[化学工程—电化学工业]