引线框架塑封集成电路冲切过程中的检测和防护  

Detection and Protection of IC′s Trim/Form System

作　　者：付小青 FU Xiaoqing(Tongling Sanjia Yamada Tech.Co.,Ltd.,Tongling 244000,China)

机构地区：[1]铜陵三佳山田科技股份有限公司,安徽铜陵244000

出　　处：《电子与封装》2021年第2期64-67,共4页Electronics & Packaging

摘　　要：在引线框架塑封集成电路的引线冲切成型过程中,存在塑封体破裂脱落、引脚折断等异常现象,如果不能及时发现这些异常,就会造成产品的批量报废或相关成型模具损坏的情况。介绍了如何使用光电传感器和检测针系统对集成电路引脚冲切成型中可能出现的异常进行有效监测和防护。In the process of the integrated circuit's lead trimming&forming,the abnormal things such as tiebar fracture,crack of plastic seal and breakage of lead are appeared.In the production of circuit products,if these anomalies can not be found in time,it will result in mass scrapping of the product and damage to the related T/F equipment.This paper introduces how to use photoelectric sensor and detection pin system to detect and protect the possible anomalies in the trimming and formming of the lead of the integrated circuit.

关 键 词：半导体 检测和防护 光电传感器 检测针系统 

分 类 号：TN305.94[电子电信—物理电子学]