微波组件硅铝丝键合工艺参数的优化  

Optimization of Bonding Parameters of Silicon-aluminum Wire of Microwave Components

作　　者：刘波[1] 崔洪波[1] 郭倩[1] LIU Bo;CUI Hongbo;GUO Qian(The 55th Research Institute of CETC,Nanjing 210016,China)

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210016

出　　处：《电子工艺技术》2021年第1期16-19,37,共5页Electronics Process Technology

基　　金：基础性稳定支持专用项目(2018N201)。

摘　　要：通过控制单一变量的试验方法,研究了超声功率、超声时间、键合压力等参数对硅铝丝键合一致性和可靠性的影响,分析了每个参数对硅铝丝键合的影响规律。通过正交试验方法,优化了键合参数组合,并进行试验验证。通过环境试验对微波组件中硅铝丝键合的可靠性进行评价,在某产品上进行验证,并抽样对其可靠性进行评价。产品键合点形貌良好,一致性高,满足产品质量要求。通过优化工艺参数,实现了该类芯片的高可靠的硅铝丝互连。给出了Si基铝Pad芯片键合的参数参考范围,对微波组件Si基铝Pad芯片引线互连技术具有一定的指导意义。By controlling the test method of single variable,the effects of ultrasonic power,ultrasonic time,bonding pressure and other parameters on the bonding and reliability of silicon aluminum wire are studied,the influence rules of each parameter on silicon aluminum wire bonding are analyzed.Through orthogonal test method,the combination of bonding parameters is optimized,and the experimental verification is carried out.The reliability of silicon-aluminum wire bonding in microwave components is evaluated by environmental test,verified on a product,and evaluated by sampling.The product has good bonding points and high consistency,which meets product quality requirements.By optimizing the process parameters,a highly reliable silicon-aluminum wire interconnect of this type of chip is realized.The reference range of the parameters of silicon aluminum wire bonding is given,which has a certain guiding significance for the interconnection technology of Silicon substrate aluminum Pad chip in the microwave components.

关 键 词：微波组件 硅铝丝键合 控制单一变量 正交试验 

分 类 号：TN605[电子电信—电路与系统]