脉冲电镀在印制电路板中的应用  

Application of Pulse Electroplating in PCB

作　　者：安维[1] 曾福林[1] 李敬科[1] 舒平 AN Wei;ZENG Fulin;LI Jingke;SHU Ping(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;Jiangxi Broad Chemical Co.,Ltd.,Ji'an 331603,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057 [2]江西博泉化学有限公司,江西吉安331603

出　　处：《电子工艺技术》2021年第1期20-22,41,共4页Electronics Process Technology

摘　　要：随着5G时代的到来,大尺寸、高层数﹑高厚径比印制板成为PCB行业的发展趋势。随着厚径比越来越大,电镀铜成为制约5G PCB量产的关键技术。相比传统直流电镀,脉冲电镀在高电流密度条件下可以减少生产周期,可靠性更高,电镀更加均匀,因此越来越多PCB厂家选用脉冲电镀药水进行生产,以满足更高标准的工艺要求。主要介绍了脉冲电镀药水的各项性能测试方法及性能表现。With the advent of the 5G era in recent years,large-size PCB,multi-layer PCB,and PCB with high aperture ratios have become the development trends of the PCB industry.As the thickness-diameter ratio increases,copper electroplating becomes a key technology that restricts the mass production of 5G PCB.Compared with traditional DC electroplating,pulse electroplating has lower production cycle,higher reliability,and more even electroplating under high current density.Therefore,more and more PCB manufacturers use pulse electroplating solution to meet higher process requirements.The performance test methods and performance of the pulse electroplating solution is described.

关 键 词：脉冲电镀 5G PCB 

分 类 号：TN605[电子电信—电路与系统]