大载流厚铜高密度互连印制板制作研究  

Study on manufacturing technology of large current-carrying thick copper HDI board

作　　者：潘捷 寻瑞平 高赵军 张雪松 Pan Jie;Xun Ruiping;Gao Zhaojun;Zhang Xuesong(不详)

机构地区：[1]江门崇达电路技术有限公司研发部,广东江门529000 [2]江门崇达电路技术有限公司,广东江门529000

出　　处：《印制电路信息》2021年第2期9-14,共6页Printed Circuit Information

摘　　要：用于电动汽车等新能源设备的大载流厚铜高密度互连印制板有广阔的发展前景。文章选取一款整体14层,集厚铜、高密度互连、金属化槽、树脂塞孔等设计为一体的典型大载流厚铜高密度互连印制板产品,就其制作工艺流程以及技术难点做了详细阐述,希望能给业界同行提供一定的参考。The large current-carrying thick copper HDI board used in electric vehicles and other new energy equipment shows a broad development prospect.This paper chose a 14 layers typical large current-carrying thick copper HDI product,which integrated thick copper,HDI,PTH slots,resin plugging,etc.,and elaborated the manufacturing technological process and difficulties,which,hopefully,can provide some references for scholars engaged in PCB industry.

关 键 词：印制电路板 厚铜 高密度互连板 激光盲孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]