亚甲基蓝对直流电镀纳米孪晶铜组织及力学性能的影响  

Effect of Methylene Blue on the Microstructure and Mechanical Propertiesof Nanotwinned Copper during DC Electroplating

作　　者：黄静 李忠国 高丽茵 李晓 李哲 刘志权 孙蓉[1,3] HUANG Jing;LI Zhongguo;GAO Liyin;LI Xiao;LI Zhe;LIU Zhiquan;SUN Rong(Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China;College of Chemical Engineering and Environment,China University of Petroleum-Beijing,Beijing 102249,China;Shenzhen Institute of Advanced Electronic Materials,Shenzhen 518103,China)

机构地区：[1]中国科学院深圳先进技术研究院,深圳518055 [2]中国石油大学(北京)化学工程与环境学院,北京102249 [3]深圳先进电子材料国际创新研究院,深圳518103

出　　处：《集成技术》2021年第1期55-62,共8页Journal of Integration Technology

基　　金：广东省基础与应用基础研究基金项目(2019A1515110771,2019A1515110469)。

摘　　要：纳米孪晶铜具有高强高导高韧的优异性能,使其成为近年来电子封装领域的研究热点。众所周知,添加剂在直流电镀过程中对镀层质量起着至关重要的作用。亚甲基蓝作为一种常用的染料型添加剂,在电镀铜行业中被广泛使用。该研究在直流电镀过程中,将不同浓度的亚甲基蓝添加到纳米孪晶铜电解液中,并进一步研究纳米孪晶铜的微观组织和力学性能与亚甲基蓝添加浓度的关系。随着亚甲基蓝浓度的增加,镀膜的生长速度缓慢下降,晶粒逐渐细化。当亚甲基蓝浓度为2 mg/L时,可以看到自底向上生长的柱状晶,且存在高密度孪晶结构。使用动态热机械分析仪对其力学性能进行测试发现,此浓度下薄膜的拉伸强度可达到194 MPa,约为粗晶铜的2倍(约110 MPa);薄膜表面维氏硬度可以达到1.6 GPa,优于普通粗晶铜硬度。Nanotwinned copper has excellent properties of high strength,high conductivity and high toughness,which makes it a research hotspot in the field of electronic packaging in recent years.During the electrodeposit procedure,the additives play a vital role in the quality and property of nanotwinned copper.Among these additive,methylene blue is commonly used in the direct-current(DC)electroplating regular copper industry.In this study,the effect of methylene blue on the microstructure and mechanical property of nanotwinned copper was investigated.It was found that the microscopic morphology and mechanical properties of nanotwinned copper are closely related to the concentration of methylene blue.As the concentration increases,the growth rate of electrodeposits shows a decreasing tendency,demonstrating a strong grain refinement effect.When the methylene blue concentration is 2 mg/L,columnar grains start growing from the bottom substrate to upper surface,and there exists a high-density twin structure within the columnar grains.What’s more,the tensile strength of the film at this concentration is 194 MPa,which is almost twice as that of regular coarse-grain copper(about 110 MPa)as measured by the dynamic thermomechanical analyzer(DMA).The surface hardness of the film can reach 1.6 GPa,which is also higher than the hardness of coarse-grained copper.

关 键 词：纳米孪晶铜 亚甲基蓝 直流电镀 拉伸强度 

分 类 号：TQ153[化学工程—电化学工业]