陶瓷封装倒装焊器件Sn-Pb微焊点的电迁移行为  

Electromigration Behavior of Sn-Pb Micro Solder Joints in Ceramic Flip-Chip Devices

作　　者：文惠东 胡会献 张代刚 谢晓辰 林鹏荣 Wen Huidong;Hu Huixian;Zhang Daigang;Xie Xiaochen;Lin Pengrong(Beijing Microelectronics Technology Institution,Beijing 100076,China)

机构地区：[1]北京微电子技术研究所,北京100076

出　　处：《半导体技术》2021年第1期70-74,共5页Semiconductor Technology

摘　　要：高密度陶瓷封装倒装焊器件的焊点尺寸已降低至100μm以下,焊点电流密度达到10~4 A/cm~2以上,由此引发的电迁移失效成为不可忽视的问题。以陶瓷封装菊花链倒装焊器件为研究对象,开展了Sn10Pb90、Sn63Pb37焊点热电环境可靠性评估试验,通过电连接检测及扫描电子显微镜(SEM)等方法对焊点互连情况进行分析。结果表明,Sn63Pb37焊点阴极侧金属间化合物(IMC)增长明显,表现出明显的极化现象,IMC厚度的平方与通电时间呈线性关系。通电时间达到576 h后Sn63Pb37焊点阴极侧产生微裂纹,而Sn10Pb90焊点在通电576 h后仍未出现异常,表现出优异的电迁移可靠性。研究结果对于直径100μm微焊点的陶瓷封装倒装焊器件的应用具有重要的意义。Solder joint size of the high density ceramic flip-chip device has reduced to below 100μm,and the current density in the solder joint reaches above 10~4 A/cm~2.Therefore,the electromigration failure caused by this problem can′t be ignored.The ceramic daisy-chain flip-chip device was taken as the research object,and the reliability evaluation experiment under thermoelectric environment was carried out for Sn10 Pb90 and Sn63 Pb37 solder joints.The solder joint interconnection was analyzed by using electrical connection detection and scanning electron microscope(SEM).The results show that intermetallic compound(IMC)at the cathode of Sn63 Pb37 solder joint increases significantly,which shows obvious polarization.The square of IMC thickness shows a linear relationship with the operating time.The micro cracks appear at the cathode of the Sn63 Pb37 solder joint after 576 h,while no abnormal phenomenon is found in the Sn10 Pb90 solder joint after 576 h,showing an excellent electromigration reliability.The research results are of great significance for the application of ceramic flip-chip devices with a diameter of 100μm micro solder joints.

关 键 词：倒装焊 Sn-Pb焊点 大电流密度 电迁移 金属间化合物(IMC)形态 

分 类 号：TN305.94[电子电信—物理电子学]