Parylene C薄膜微波电路的应用可行性研究  

Application Feasibility of Parylene C Film in Microwave Circuit

作　　者：张亚楠 孙鹏 周澄[1] ZHANG Yanan;SUN Peng;ZHOU Cheng(Xi'an Institute of Space Radio Technology,Xi'an 710000)

机构地区：[1]西安空间无线电技术研究所,西安710000

出　　处：《宇航材料工艺》2021年第1期55-59,共5页Aerospace Materials & Technology

摘　　要：针对三防材料在微波电路中多余物防控方面的可行性、可靠性问题,提出在产品表面用真空化学气相沉积法镀Parylene C薄膜,结果表明该膜层可有效控制直径d小于1 mm的可动多余物,提高微波产品PIND(颗粒碰撞粒子检测)测试的合格率。同时与焊接、胶粘、互联、清洗等配装工艺有良好的适配性,且满足可靠性要求。该薄膜较高的绝缘强度,对微波电路有优异的绝缘防护作用。说明Parylene C薄膜材料在微波产品中具有应用可行性和潜在价值。The coating material feasibility and reliability in the prevention and control of remnant material in micro wave circuits was studied.The vacuum chemical vapor deposition method to deposit Parylene C film on the product surface was proposed.The experimental results show that the film can effectively control the remnant material with a diameter of less than 1 mm,and improve the pass rate of particle impact noise detection test.In the meantime,the film has good compatibility with assembly processes such as welding,gluing,interconnecting,and cleaning and meets the reliability requirements.The film has high insulation strength and excellent insulation protection for microwave circuit.Consequently,the arylene C film has application feasibility and potential value in microwave products.

关 键 词：微波产品 Parylene C薄膜 真空化学气相沉积法 多余物 可行性 

分 类 号：TB34[一般工业技术—材料科学与工程]