印制电路板孔金属化中离子钯还原机理分析与溶液管控  

Mechanism analysis and control of ion palladium reduction in PCB hole metallization

作　　者：陈金文 汪忠林 何燕春 杜姣 Chen Jinwen;Wang Zhonglin;HeYanchun;Du Jiao(Jiangmen Suntak Circuit Technology Co.,Ltd.,Guangdong Intelligent Industrial Control PCB Engineering and Technology Research and Development Center,Jiangmen 529000,Guangdong,China)

机构地区：[1]中国航空工业集团公司西安航空计算技术研究所,陕西西安710068

出　　处：《印制电路信息》2021年第3期41-45,共5页Printed Circuit Information

摘　　要：在不影响产量、质量的前提下,成本最小化是每个单位持续追求的目标。文章对化学沉铜中离子钯还原成原子钯的机理进行了详细分析,并根据机理分析,对该过程的管控、降本提出有效措施。On the premise of not affecting the output and quality,the goal of each unit is to minimize the cost.In this paper,the mechanism of the reduction of ion Palladium to atomic Palladium in Chemical copper deposition is analyzed in detail.Based on the mechanism analysis,some suggestions for the control and cost reduction of the process are put forward.

关 键 词：印制电路板 化学沉铜 离子钯 

分 类 号：TN41[电子电信—微电子学与固体电子学]