提高基于专用芯片HIGS-X32A2产品可靠性的实验研究  

Experimental Research on Improving the Reliability of Products Based on Dedicated Chip HIGS-X32A2

作　　者：刘刚[1] 马牧燕[1] 仵思笛 张艺伟 LIU Gang;MA Mu-yan;WU Si-di;ZHANG Yi-wei(School of Instrument Science and Optoelectronic Engineering,Beijing Information Science&Technology University,Beijing 100192)

机构地区：[1]北京信息科技大学仪器科学与光电工程学院,北京100192

出　　处：《现代计算机》2021年第2期116-120,共5页Modern Computer

基　　金：2019实培计划(No.GDXY20191009)。

摘　　要：借助自主研发的Release仿真软件,对专用芯片HIGS-X32A2进行预失效验证,获得专用芯片良品率范围表;进而通过芯片封装技术及光电探测器组装技术并结合制程工序的检测测量,监测可能对专用芯片产品性能产生影响的各种因素;从而提高基于专用芯片HIGS-X32A2产品的可靠性。With the help of self-developed Release simulation software,the pre-failure verification for the dedicated chip HIGS-X32A2 is conduct and the yield range table of dedicated chip is obtained.Furthermore,through the chip packaging technology and photoelectric detector as⁃sembly technology combined with the detection and measurement of the manufacturing process,various factors that may affect the perfor⁃mance of the dedicated chip product are monitored.Thereby,the reliability of products based on the dedicated chip HIGS-X32A2 is im⁃proved.

关 键 词：HIGS-X32A2专用芯片 制程工艺 光电探测器 

分 类 号：TN407[电子电信—微电子学与固体电子学]