一体化晶圆级MMIC自动测试技术研究  

Research on highly-integrated wafer-level solution for MMICs automatic test technology

作　　者：丁旭 王志宇[2] Ding Xu;Wang Zhiyu(Zhejiang Chengchang Technoloy Co.,Ltd.,Hangzhou 310030,China;School of Aeronautics and Astronautics,Zhejiang University,Hangzhou 310027,China)

机构地区：[1]浙江铖昌科技股份有限公司,杭州310030 [2]浙江大学航空航天学院,杭州310027

出　　处：《国外电子测量技术》2020年第12期95-103,共9页Foreign Electronic Measurement Technology

摘　　要：提出了一种一体化晶圆级微波单片集成电路(MMIC)自动测试技术方案,对矢量网络分析仪主控接口进行深度开发,采用以工控机和矢量网络分析仪为核心的双核控制拓扑结构,基于三级软件驱动架构编写系统自动测试软件,融合了扩展OSL去嵌法、在片校准验证模型、高精度功率附加效率(PAE)测试、优化的矢量冷源噪声测试法等多种先进的高精度测试技术。采用该技术方案后测试系统十分简捷,只需一次探针接触便可获得被测器件的全部参数,避免了测试系统的频繁切换对测试精度和速度的不利影响,大大提高了测试效率。Present a highly-integrated wafer-level technical solution for MMICs automatic test.With deeply developed main control interface of the VNA,the technology adopts the dual-core topology,uses the IPC and VNA as the two cores.The system’s automatic test software is based on three-level driver architecture.To optimize the whole system,the solution integrates the OSL two tier de-embedding method,the calibration verification model,the accurate PAE testing and the optimized vector cold source NF measurement techniques together.Benefit from this technology,all the data of a MMIC can be achieved in only one probecontact,which is much more accurate and efficient than existing systems.

关 键 词：在片测试 MMIC自动测试系统 双核控制模式 扩展OSL去嵌 校准验证模型 

分 类 号：TN98[电子电信—信息与通信工程]