28nm WLP封装中PBO结构对CPI可靠性的影响  

Effects of PBO Structures on CPI Reliability of 28 nm Wafer Level Package

作　　者：秦冲 毛海央 陈险峰 李义 QIN Chong;MAO Haiyang;CHEN Xianfeng;LI Yi(University of Chinese Academy of Sciences,Beijing 100049,P.R.China;SMIC Integrated Circuit Manufacturing Co.,Ltd.(Shanghai)201203,P.R.China)

机构地区：[1]中国科学院大学,北京100049 [2]中芯国际集成电路制造(上海)有限公司,上海201203

出　　处：《微电子学》2021年第1期126-131,共6页Microelectronics

基　　金：广东省重点领域研发计划项目(2019B010117001)。

摘　　要：基于28 nm晶圆级封装(WLP)工艺,研究了聚苯撑苯并噁唑(PBO)对芯片-封装交互(CPI)可靠性的影响,分析了PBO堆叠关系和边缘位置的选择对CPI可靠性的影响。仿真实测结果表明,堆叠关系和边缘位置的变化对CPI可靠性有较显著的影响,两种因素的失效机理不同。利用TCAD工具能够有效预测结构变更对CPI可靠性的影响,从而优化结构设计,提升WLP封装的CPI可靠性。Based on a 28 nm wafer level package(WLP) packaging process, the influence of poly-benzoxazole(PBO) structures on chip-package interaction(CPI) reliability was studied, and the influence of PBO stacking relationship and edge position selection on CPI reliability was analyzed. The simulation and test results showed that the changes of stack relation and edge position had a significant influence on the reliability of CPI. The failure mechanisms of the two factors were different. The use of TCAD tools could effectively predict the impact of structural changes on CPI reliability, so as to optimize the structural design and improve the CPI reliability of WLP.

关 键 词：CPI可靠性 晶圆级封装 聚合物结构 

分 类 号：TN306[电子电信—物理电子学]