镀层结构对压延铜箔表面颜色的影响  

Effect of coating structure on color of rolled copper foil

作　　者：王佳兴 刘新宽[1] 李楚方 乔亚峰 WANG Jiaxing;LIU Xinkuan;LI Chufang;QIAO Yafeng(University of Shanghai for Science and Technology,Shanghai 200093,China;Chinalco Huazhong Copper Industry Co.,Ltd.,Huangshi 435000,China)

机构地区：[1]上海理工大学材料科学与工程学院,上海200093 [2]中铝华中铜业有限公司,湖北黄石435000

出　　处：《电镀与涂饰》2021年第5期352-357,共6页Electroplating & Finishing

摘　　要：采取无氰电镀技术使压延铜箔表面黑化,镀液配方为:硫酸镍40~60 g/L,柠檬酸钠20~30 g/L,硼酸30~50 g/L,硫酸铵5~15 g/L,表面活性添加剂5~15 g/L。从扫描电镜(SEM)和透射电镜(TEM)对镀层表面与横截面形貌的观察发现,晶粒间距和晶粒高度对镀层颜色有决定性影响。当晶粒间距超过0.7μm,同时晶粒高度超过0.8μm时,镀层会变黑。能谱(EDS)分析证实黑化镀层表面不含有任何硫化物,说明镀层并非物质致黑,而是由于形成了“光陷阱”结构而发黑。The surface of rolled copper foil was blackened by electroplating in a cyanide-free bath comprising nickel sulfate 40-60 g/L,sodium citrate 20-30 g/L,boric acid 30-50 g/L,ammonium sulfate 5-15 g/L,and surface active additive 5-15 g/L.It was found from the surface and cross-sectional morphologies of the nickel coating by scanning electron microscopy(SEM)and transmission electron microscopy(TEM)that the grain spacing and grain height have a decisive influence on the color of the nickel coating.When the grain spacing exceeds 0.7μm and the grain height exceeds 0.8μm,the nickel coating will turn black.The energy-dispersive spectroscopic(EDS)analysis confirmed that the surface of the blackened nickel coating do not contain any sulfides,indicating that the blackening of nickel coating was not induced by substances,but due to the formation of a“light trap”structure.

关 键 词：压延铜箔 电镀镍 黑化 晶粒结构 光陷阱 机理 

分 类 号：TQ153.2[化学工程—电化学工业]