印制电路板连通性失效的分析思路和方法研究  

Research on analysis ideas and methods of PCB continuity failure

作　　者：张永华[1] 李成虎[1] 刘立国[1] Zhang Yonghua;Li Chenhu;Liu Liguo

机构地区：[1]无锡江南计算技术研究所军用印制板质量检测中心,江苏无锡214083

出　　处：《印制电路信息》2021年第4期48-52,共5页Printed Circuit Information

摘　　要：连通性失效是印制电路板最常见的失效模式之一,文章结合典型失效分析案例,重点探讨了连通性缺陷的准确定位方法,失效模式的确认方法,以及失效机理的分析方法等,并总结了遇到该类问题时应正确采取的分析思路和操作流程。Continuity failure is one of the most common failure modes of PCB.Combined with typical failure analysis cases,this article focuses on the accurate location methods of PCB continuity defect,the confirmation methods of failure mode,and the analysis methods of failure mechanism.This article summarizes the analysis ideas and operation procedures that should be correctly adopted when dealing with such problems.

关 键 词：连通性 失效分析 镀覆孔缺陷 

分 类 号：TN41[电子电信—微电子学与固体电子学]