宇航微波组件金带连接可靠性研究  

Study on Reliability of Gold Band Connection for Aerospace Microwave Components

作　　者：金蓓蓓 许迪 陈桂莲 刘晓阳 马晓萌 Jin Beibei;Xu Di;Chen Guilian;Liu Xiaoyang;Ma Xiaomeng(Shanghai Aerospace Electronic Technology Institute,Shanghai 201109)

机构地区：[1]上海航天电子技术研究所,上海201109

出　　处：《航天制造技术》2021年第1期54-57,共4页Aerospace Manufacturing Technology

摘　　要：在宇航领域微波组件射频同轴电连接器与微带板间的互连工艺中,金带连接作为一种高可靠柔性互连方式,具有优异的微波性能,能够降低结构热应力和机械应力。在金带连接工艺中,金带与镀金微带线或电连接器芯线之间的焊接强度尤为关键。本文通过正交试验、拉力试验等方法研究了金带连接工艺参数对焊接强度的影响,得到了最优工艺参数;通过金相分析研究了焊点内部熔合情况;通过分析焊点拉断情况和拉力曲线,研究了焊接机理。As a highly reliable and flexible interconnection method between rf coaxial electrical connectors of microwave components and microstrip circuit board in the aerospace field,the gold band connection has excellent microwave performance and can reduce the thermal and mechanical stress of the structure.In the process of gold band connection,the welding strength between gold band and gold-plated microstrip wire or electric connector core wire is particularly critical.In this paper,the influence of the technological parameters of gold band connection on the welding strength is studied by means of orthogonal test and tensile test,and the optimal technological parameters are obtained.The internal condition of the welding joint is studied through metallographic analysis.The welding mechanism is studied by analyzing the tensile curve and the tensile condition of the welding joint.

关 键 词：射频连接器 互连工艺 金带连接 电阻焊 

分 类 号：V443[航空宇航科学与技术—飞行器设计]