玻璃通孔技术研究进展  

Development of Through Glass Via Technology

作　　者：陈力 杨晓锋 于大全 CHEN Li;YANG Xiaofeng;YU Daquan(School of Electronic Science and Engineering,Xiamen University,Xiamen 361000,China;Xiamen Sky Semiconductor Co.,Ltd.,Xiamen 361026,China)

机构地区：[1]厦门大学电子科学与技术学院,福建厦门361000 [2]厦门云天半导体科技有限公司,福建厦门361026

出　　处：《电子与封装》2021年第4期1-13,共13页Electronics & Packaging

基　　金：国家自然科学基金(61974121)。

摘　　要：近年来,随着5G、可穿戴设备、智能手机、汽车电子、人工智能等新兴领域蓬勃兴起,集成电路应用正向着多元化应用方向发展,先进三维封装技术也逐渐成为实现电子产品小型化、轻质化、多功能化的重要手段。玻璃通孔(TGV)互连技术具有高频电学特性优异、成本低、工艺流程简单、机械稳定性强等应用优势,在射频器件、微机电系统(MEMS)封装、光电系统集成等领域具有广泛的应用前景。综述了国内外高密度玻璃通孔制作、金属填充、表面高密度布线的研究进展,对玻璃通孔技术特点及其应用进行了总结。In recent years,with the booming of 5G,wearable devices,smart phones,automotive electronics,artificial intelligence and other emerging fields,integrated circuit applications are developing towards the direction of diversification,and advanced three-dimension packaging technology has gradually become an important means to achieve miniaturization,lightness and multi-function of electronic products.Through glass via(TGV)technology has the advantages of excellent high-frequency electrical characteristics,low cost,simple process flow,strong mechanical stability and so on,so it has a broad application prospect in RF devices,MEMS packaging,photoelectric system integration and other fields.In this paper,the research progress of the formation of high-density TGVs,metal filling of TGVs and high-density redistribution layer(RDL)technology in china and abroad is reviewed,and the characteristics of TGV technology and its application are summarized.

关 键 词：玻璃转接板 玻璃通孔 金属填充 高密度布线 

分 类 号：TN305.96[电子电信—物理电子学]