浅谈PCB化学镀铜工艺环境问题及治理  

Environmental Problems and Treatment of PCB Electroless Copper Plating Process

作　　者：叶先英 白艳 YE Xian-ying;BAI Yan

机构地区：[1]金川集团铜业有限公司环保科技有限公司,甘肃金昌737100 [2]金川集团铜业有限公司,甘肃金昌737100

出　　处：《有色设备》2021年第2期68-70,81,共4页Nonferrous Metallurgical Equipment

摘　　要：随着PCB电镀行业的快速发展,电镀产生的环境问题越来越受到重点关注,PCB化学镀铜废水和污泥中含有重金属离子铜污染物,对人体和环境具有很大的危害,通过现有技术的组合搭配实现铜资源的回收,不仅可以降低环境的污染,而且还可以为企业增加效益。本文针对PCB化学镀铜工艺中的污染物分析,提出了污染物治理的建议,以供参考。With the rapid development of PCB electroplating industry,more and more attention has been paid to the environmental problems caused by electroplating,The waste water and sludge of PCB electroless copper plating contain heavy metal ions and copper pollutants,which are very harmful to human body and environment.The recycling of copper resources through the combination and collocation of existing technologies can not only reduce environmental pollution,but also increase benefits for enterprises.In this paper,the pollution analysis of PCB electroless copper plating process and the suggestion of pollution control are put forward for reference.

关 键 词：化学镀铜 重金属废水 污泥处理 

分 类 号：TF811[冶金工程—有色金属冶金]