电解铜箔生产工艺条件对其性能的影响  

Effects of process conditions on properties of electrolytic copper foil

作　　者：宋言 林毅 SONG Yan;LIN Yi(Jiangxi Copper Technology Research Institute Co.,Ltd.,Nanchang 330500,China)

机构地区：[1]江西铜业技术研究院有限公司,江西南昌330500

出　　处：《电镀与涂饰》2021年第7期555-559,共5页Electroplating & Finishing

摘　　要：考察了电解铜箔生产中较易控制的工艺参数,如电解液温度,流速,钛板粗糙度与打磨方式,以及后处理时的温度与摆放方式,对电解铜箔的表面形貌、粗糙度、抗拉强度、断裂总延伸率、光泽等方面的影响。电解溶液温度和流速控制在合适的范围,钛阴极辊的粗糙度(Rz)控制在2μm以下,以及打磨时砂路尽量顺直,都有利于制备出符合要求的铜箔。后处理加热和令毛面朝下可以加快铜箔残余内应力的释放,降低其翘曲。The effects of several process conditions easily controlled during the production of electrolytic copper foil i.e.temperature,flow rate,roughness and polishing method of titanium plate,as well as temperature and laying way in posttreatment on the surface morphology,roughness,tensile strength,total breaking elongation,and gloss of electrolytic copper foil were studied.Controlling the temperature and flow rate of electrolyte within an appropriate range,providing the cathodic titanium roller a roughness(Rz)2μm below,and polishing the cathodic titanium roller as straightly as possible are all beneficial for preparation of favorable copper foils.Post-heating where the rough side is towards the ground helps to accelerate the release of residual stress inside the copper foil,reducing the risk of warpage.

关 键 词：电解铜箔 温度 流速 力学性能 光泽 粗糙度 

分 类 号：TQ153.14[化学工程—电化学工业]