陶瓷填充PTFE高频混压板通孔等离子体去钻污参数选择  

The parameter selection of plasma desmear for through hole on ceramic filled PTFE high frequency hybrid board

作　　者：刘根 戴晖 刘喜科 杨庆辉 Liu Gen;Dai Hui;Liu Xike;Yang Qinghui(Meizhou Zhihao Electronic Technology Co.,LTD Guangdong meishou 514000)

机构地区：[1]梅州市志浩电子科技有限公司,广东梅州514000

出　　处：《印制电路信息》2021年第5期34-39,共6页Printed Circuit Information

摘　　要：随着第五代移动通信技术(5G)的快速发展,聚四氟乙烯(PTFE)高频印制电路板在高频信号传输领域大量应用。文章研究了电极功率、有效除胶时间以及除胶温度等参数对陶瓷填充PTFE高频混压板去钻污的影响,从孔粗、芯吸、层间分离指标表征经等离子体工艺金属化通孔的孔壁质量。通过实验和理论分析,对陶瓷填充PTFE高频混压板等离子体工艺采用较高的电极功率、反映材料属性的除胶温度、有效除胶时间,建立起PTFE高频混压板等离子单位去钻污量与孔内形貌的匹配机制。With the rapid development of the fifth-generation mobile communication technology(5G),the PTFE(polytetrafluoroethylene)high-frequency printed circuit boards are widely used in the field of high frequency signal transmission.This paper studies the effect of electrode power,effective plasma desmear time and temperature on decontamination of ceramic filled PTFE high-frequency mixing-laminated board.The pore wall quality of metallized through-holes was characterized by hole diameter,wicking and interlayer separation defects.Through experiment and theoretical analysis,the plasma technology of ceramic filled PTFE high-frequency mixing laminated boards was discussed.High electrode power temperature and time are used to generate sufficient and relatively stable plasma.The plasma desmear is used to provide theoretical guidance for establishing the matching mechanism between the desmear weight of plasma and the morphology in the hole of PTFE high-frequency mixing laminated boards.

关 键 词：聚四氟乙烯 等离子体 去钻污 高频 混压板 

分 类 号：TN41[电子电信—微电子学与固体电子学]