密集金属化孔的可靠性影响因素分析  

Analysis of factors affecting reliability of dense metallized holes

作　　者：蓝春华 范伟名 唐心权 Lan Chunhua;Fan Weiming;Tang Xinquan

机构地区：[1]景旺电子科技(龙川)有限公司,广东河源517373 [2]广东省金属基印制板工程技术研究开发中心,广东河源517373

出　　处：《印制电路信息》2021年第5期40-44,共5页Printed Circuit Information

摘　　要：随着线路的细密化,印制电路板(PCB)导通孔越来越密集,金属化孔制作技术难度不断提高。本文从PCB制作工艺中涉及金属化孔可靠性的压合、钻孔、除胶、电镀等方面进行分析,设计密集孔测试模块结合回流焊测试、耐CAF测试、冷热循环测试等可靠性测试行验证对比,总结预防密集金属化可靠性失效的关键点。With the refinement of the circuit,PCB through holes distribution is more and more dense,and the technical difficulty of making metallized holes is increasing.This article analyzes the PCB production process which is about the metallized hole reliability pressing,drilling,desmear,plating and designing dense hole test coupon combined with reflow test,CAF test,thermal cycling test and other reliability test verification and comparison.It summarizes the key points of preventing the reliability failure of dense metallized holes.

关 键 词：金属化孔 可靠性 失效关键点 验证分析 

分 类 号：TN41[电子电信—微电子学与固体电子学]