基于三维集成技术的Ku波段四通道T/R模块  

Ku-Band Four-Channel T/R Module Based on 3D Integration Technology

作　　者：张鸣一 朱春雨 刘文豹[1] 要志宏[1] Zhang Mingyi;Zhu Chunyu;Liu Wenbao;Yao Zhihong(The 13^(th)Research Institute,CETC,Shaijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051

出　　处：《半导体技术》2021年第4期286-289,329,共5页Semiconductor Technology

摘　　要：基于三维集成技术研制了一款适用于表面贴装技术的Ku波段四通道T/R模块。模块内部设计成两层层叠结构,层间使用球栅阵列实现互连,仿真分析模块微波垂直互连结构、腔体谐振和散热模型,实现模块的小型化。模块集成了数控移相、数控衰减和串并转换等功能,由幅相控制多功能芯片、开关功率放大器芯片、限幅低噪声放大器和控制芯片构成。测试结果显示,在Ku波段内,单路发射通道饱和输出功率大于30 d Bm,接收通道增益大于20 d B,噪声系数小于3.5 d B,模块尺寸为16 mm×16 mm×2.5 mm。Based on 3D integration technology,a Ku-band four-channel T/R module suitable for surface mounted technology was developed.The internal design of the module was a two-layer laminated structure,and the ball grid array was used to realize the interconnection between the layers.The microwave vertical interconnection structure,cavity resonance and heat dissipation model of the module were simulated and analyzed to realize the miniaturization of the module.The module integrated functions such as digital control phase shifting,digital control attenuation and serial-to-parallel conversion,and was composed of a multi-function chip for amplitude and phase control,a switching power amplifier chip,a limiting low noise amplifier and a control chip.The test results show that in the Ku-band,the saturated output power of the single transmitting channel is greater than 30 d Bm,the gain of the receiving channel is greater than 20 d B,the noise figure is less than 3.5 d B,and the module size is 16 mm×16 mm×2.5 mm.

关 键 词：T/R模块 小型化 三维集成 KU波段 垂直互连 

分 类 号：TN958.92[电子电信—信号与信息处理]