树脂基复合材料微胶囊自修复技术综述  被引量:4

Review of Microencapsulated Self-healing Technology for Resin Matrix Composite

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作  者:韩闯[1] 杨帆[1] 郭兴魁 矫维成[1] 郝立峰[1] 刘文博[2] 王荣国[1] HAN Chuang;YANG Fan;GUO Xingkui;JIAO Weicheng;HAO Lifeng;LIU Wenbo;WANG Rongguo(Center for Composite Material and Structure,Harbin Institute of Technology,Harbin 150001;School of Material Science and Engineering,Harbin Institute of Technology,Harbin 150001)

机构地区:[1]哈尔滨工业大学复合材料与结构研究所,哈尔滨150001 [2]哈尔滨工业大学材料学院,哈尔滨150001

出  处:《纤维复合材料》2021年第1期61-64,共4页Fiber Composites

摘  要:微胶囊自修复技术通过在树脂中包埋胶囊来实现材料的快速损伤监测和起始损伤修复。本文综述了微胶囊修复技术中针对微胶囊形状和尺寸的参数优化方法。同时,综述了微胶囊在树脂基体中与裂纹作用的研究方法。分析了现有微胶囊自修复技术设计中存在的未考虑修复剂物理特性的问题。展望了未来微胶囊自修复技术与可视化材料监测及全局自修复材料技术相融合的发展前景。Microencapsulated self-healing technology enables rapid damage monitoring and initiated damage repairing of materials by encapsulating microcapsules in resin matrix. In this paper,several methods of parameter optimization for microcapsule shape and size in microcapsule self-healing technology are reviewed. Moreover,several analytical methods for the interaction of microcapsules with cracks in a resin matrix are reviewed. The problems of the existing microencapsulated self-healing technology design that do not consider the physical properties of the repair agent are emphasized. The future development prospects of integrating microencapsulated self-healing technology with visual material monitoring and global self-healing material technology are foreseen.

关 键 词:微胶囊 自修复 参数设计 力学分析 

分 类 号:TB332[一般工业技术—材料科学与工程]

 

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