堆叠结构BGA焊接可靠性评价方法  

Welding Reliability Evaluation Method for Stacked BGA

作　　者：冉红雷 韦婷 张魁[1,2] 黄杰[1,2] 柳华光[1,2] 赵海龙 尹丽晶[1,2] Ran Honglei;Wei Ting;Zhang Kui;Huang Jie;Liu Huaguang;Zhao Hailong;Yin Lijing(The 13^(th)Research Institute,CETC,Shijiazhuang 050051,China;National Semiconductor Device Quality Supervision and Inspection Center,Shijiazhuang 050051,China;The 58^(th)Research Institute,CETC,Wuxi 214000,China)

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050051 [2]国家半导体器件质量监督检验中心,石家庄050051 [3]中国电子科技集团公司第五十八研究所,江苏无锡214000

出　　处：《半导体技术》2021年第5期407-411,共5页Semiconductor Technology

摘　　要：设计了基于实时监测菊花链拓扑结构动态电阻的叠层球栅阵列封装(BGA)焊接可靠性评价方法,使用该方法研究叠层器件BGA焊接互连结构的环境可靠性。以基于硅通孔(TSV)技术的BGA互连的硅基双层器件为例,首先通过有限元仿真确定叠层器件各层焊点在-55~125℃条件下的应变和应力,并根据应变和应力将每一叠层焊点划分为敏感焊点和可靠焊点;然后将敏感焊点通过器件键合焊盘、键合丝、TSV、垂直过孔、可靠焊点和PCB布线相连接形成菊花链。由于敏感焊点是菊花链的薄弱环节,可以通过监测菊花链电阻变化来研究叠层器件的环境可靠性,并以此为基础设计了堆叠结构BGA产品焊接可靠性试验系统。该方法简单高效,能快速解决常规失效分析方法无法检测的BGA虚焊接、微小缺陷等问题。Based on real-time monitoring of the dynamic resistance of daisy chain topology structure,an evaluation method for welding reliability of ball grid array package(BGA)was designed to study the environmental reliability of the BGA welding interconnection structure of the stacked devices.Taking the silicon-based double-layer device of BGA welding interconnection structure based on through silicon via(TSV)technology as an example,firstly,the strain and stress of each layer’s solder joints in the stacked device at-55-125℃were determined through finite element simulation,and solder joints of each layer were divided into sensitive solder joints and reliable solder joints according to the stress and strain.Then,sensitive solder joints were connected with PCB traces through the bonding pads,bonding wires,TSV,vertical vias and reliable solder joints to form a daisy chain.As the sensitive solder joint was the weak link of the whole daisy chain,the environmental reliability of the stacked device can be studied by monitoring the resistance change of the daisy chain.Based on this,the stacked BGA reliability test system was designed.This method is simple and efficient,and can solve the problems quickly,such as virtual welding and minor defects of BGA which cannot be detected by conventional failure analysis methods.

关 键 词：球栅阵列封装(BGA) 焊接可靠性 菊花链 动态监测 应变和应力 

分 类 号：TN406[电子电信—微电子学与固体电子学]