添加剂N,N-二乙基硫脲,PEG,Cl^(-)对高抗拉电解铜箔电结晶行为的影响  

Effects of Additives N,N-Diethylthiourea,PEG and Cl^(-) on the Electro-Crystallization Behaviors of High Tensile Electrolytic Copper Foils

作　　者：杜荣斌 刘励昀 吴夏 刘涛 陈杨 陆冰沪 DU Rong-bin;LIU Li-yun;WU Xia;LIU Tao;CHEN Yang;LU Bin-hu(School of Chemistry and Chemical Engineering,Anqing Normal University,Anqing 246133,China;Anhui Tongguan Copper Foil Group Co.,Ltd.,Chizhou 247100,China)

机构地区：[1]安庆师范大学化学与化工学院,安徽安庆246133 [2]安徽铜冠铜箔集团股份有限公司,安徽池州247100

出　　处：《材料保护》2021年第4期7-14,共8页Materials Protection

基　　金：安徽省科技重大专项(18030901069);安徽省高校学科(专业)拔尖人才学术资助项目(gxbjZD202075)。

摘　　要：为了揭示在复合添加剂影响下铜电沉积的作用机理,通过线性扫描伏安(LSV)曲线和计时电流(CA)曲线研究了添加剂N,N-二乙基硫脲、聚乙二醇(PEG)和Cl^(-)共存时对铜沉积的影响,同时结合Tafel曲线判断了铜镀层的耐腐蚀性能,并通过SEM表征了铜镀层的微观形貌。试验结果表明:N,N-二乙基硫脲和PEG可以增大阴极极化、成核数密度和镀层的耐蚀性并减小Cu^(2+)的扩散系数,Cl^(-)主要在复合添加剂中起协同作用。10 mg/L N,N-二乙基硫脲、10 mg/L PEG和25 mg/L Cl^(-)协同作用时成核方式始终为瞬时成核,成核数密度达到峰值2.816×10^(6)cm^(-2),可得到平整细致的电解铜箔。For revealing the influence mechanism of composite additives on the copper electrodeposition,the cooperation effects of additives N,N-diethylthiourea,PEG and Cl^(-)on the deposition of copper were studied by linear sweep voltammetry(LSV)and chronoamperometry(CA)curves.Meanwhile,the corrosion resistance of copper plating was judged by Tafel curves,and the morphology of the copper coating was characterized by SEM.Results showed that N,N-diethylthiourea and PEG alone could increase the cathode polarization,nucleation number density and corrosion resistance of the coating and reduce the Cu^(2+)diffusion coefficient,while the presence of Cl^(-)mainly played a synergistic role in the composite additive.Under the cooperation effects of 10 mg/L N,N-diethylthiourea,10 mg/L PEG,and 25 mg/L Cl^(-),the nucleation mode was always instantaneous nucleation,and the nucleation number density reached a peak value of 2.816×10^(6)cm^(-2),which could obtain fine and smooth electrolytic copper foils.

关 键 词：电解铜箔 添加剂 极化作用 成核密度 扩散系数 

分 类 号：O646.5[理学—物理化学] O647.3[理学—化学]