MMC-HVDC系统功率器件的结温估算与寿命预测  

Research on Junction Temperature Estimation and Life Prediction of Power Devices in MMC-HVDC System

作　　者：周竞宇[1] 赵宇 胡雨龙[1] 任成林[1] 纪攀 ZHOU Jingyu;ZHAO Yu;HU Yulong;REN Chenglin;JI Pan(CSG EHV Power Transmission Company,Guangzhou 510620,Guangdong,China;TBEA Xinjiang New Energy Co.,Ltd.,Xi’an 710075,Shaanxi,China)

机构地区：[1]中国南方电网有限责任公司超高压输电公司,广州510620 [2]特变电工新疆新能源股份有限公司,陕西西安710075

出　　处：《电网与清洁能源》2021年第5期24-32,共9页Power System and Clean Energy

基　　金：南方电网公司科技项目(0100002019010706WD00026)。

摘　　要：柔性直流输电系统采用模块化多电平结构,半桥功率模块的寿命预测较为困难,提出了一种功率模块器件的结温实时监测方法及寿命耗损的评估方法。首先,研究了半桥功率模块的功率损耗计算方法,建立功率器件级的热阻模型,研究模块结温实时监测方法。然后,通过Lesit寿命模型和线性损伤累积理论对模块寿命耗损进行定量研究,结果表明,功率波动是造成IGBT损伤的重要主因。最后,开展了功率模块的加载实验工作,所述结温与寿命预测方法的仿真与实验结果基本一致。It is difficult to monitor the health of half-bridge power module in the flexible DC transmission system with modular multilevel structure.A real-time monitoring method of junction temperature and a life loss assessment method of power module devices are proposed in this paper.First,the calculation method of power loss of the half-bridge power module is studied,the thermal resistance model of the power device level is established,and the real-time monitoring method of the junction temperature of the module is studied.Second,Lesit life model and linear damage accumulation theory are used to quantitatively study the module life loss.The results show that power fluctuation is an important cause of IGBT damage.Finally,the loading experiment of the power module is carried out,and the simulation results of the junction temperature and life prediction method are basically consistent with the experimental results.

关 键 词：模块化多电平 半桥功率模块 结温 热阻模型 寿命预测 

分 类 号：TM46[电气工程—电器]