Bubble-templated Construction of Three-dimensional Ceramic Network for Enhanced Thermal Conductivity of Silicone Rubber Composites  

作　　者：Shou-Jun Li Jing-Chao Li Pei-ZhiJi Wen-Feng Zhang Yong-Lai Lu Li-Qun Zhang 

机构地区：[1]State Key Laboratory of Organic-Inorganic Composites,Beijing University of Chemical Technology,Beijing 100029,China [2]Beijing Key Laboratory of Wood Science and Engineering&MOE Key Laboratory of Wooden Material Science and Application,Beijing Forestry University,Beijing W0083,China [3]Key Laboratory of Carbon Fiber and Functional Polymers,Ministry of Education,Beijing University of Chemical Technology,Beijing 100029,China [4]Engineering Research Center of Elastomer Materials Energy Conservation and Resources,Ministry of Education,Beijing University of Chemical Technology,Beijing 100029,China

出　　处：《Chinese Journal of Polymer Science》2021年第7期789-795,共7页高分子科学（英文版）

基　　金：the financial support from the Joint Foundation of Ministry of Education for equipment pre-research(No.6141A020222XX);Post-doctoral Science Fund(No.2020M680405).

摘　　要：With the continuous development of the electronics industry,the energy density of modern electronic devices increases constantly,thus releasing a lot of heat during operation.Modern electronic devices take higher and higher request to the thermal interface materials.Achieving high thermal conductivity needs to establish an interconnecting thermal conductivity network in the matrix.For this purpose,the suspension of Al203 and curdlan was first foamed to construct a bubble-templated continuous ceramic framework.Owing to the rapid gelation property of curdlan,we can easily remove moisture by hot air drying.Finally,the high thermally conductive composites are prepared by vacuum impregnation of silicone rubber.The result showed that composites prepared by our method have higher thermal conductivity than the samples obtained by traditional method.The thermal conductivity of the prepared composite material reached 1.253 W·m^(-1)·K·^-(1)when the alumina content was 69.6 wt%.This facile method is expected to be applied to the preparation of high-performance thermal interface materials.

关 键 词：Thermally conductive network ALUMINA CURDLAN Thermal conductivity 

分 类 号：TQ333.93[化学工程—橡胶工业] TB332[一般工业技术—材料科学与工程]