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作 者:付志凯 方志浩 张磊[1] 吴卿[1] 王成刚[1] FU Zhi-kai;FANG Zhi-hao;ZHANG Lei;WU Qing;WANG Cheng-gang(North China Research Institute of Electro-Optics,Beijing 100015,China)
出 处:《红外》2021年第6期19-23,共5页Infrared
摘 要:针对大规模红外探测器的封装需求,介绍了冷箱封装结构的设计方法和特点。根据不同类型的大规模红外探测器组件的用途和需求,对其封装结构、重量、热负载以及可靠性等进行了分析,并针对某型大规模红外探测器组件的封装结构开展了优化设计。以轻量化、低功耗为设计思路,采用有限元仿真工具对封装结构进行了优化设计,使其能够满足设计要求。Aiming at the packaging requirements of large scale infrared detectors,the design methods and characteristics of cold box packaging structure are introduced in this paper.According to the use and demand of different types of large scale infrared detector assemblies,their packaging structure,weight,thermal load and reliability are analyzed and studied,and the packaging structure of large scale infrared detector assembly is optimized.Lightweight and low power consumption are taken as the design idea,and the packaging structure is optimized by the finite element simulation tool to meet the design requirements.
分 类 号:TN215[电子电信—物理电子学]
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