红外热风再流焊温度场影响因素及其规律研究  

Study on influencing factors and laws of temperature field of infrared hot air reflow soldering

作　　者：尹钰田 郑毅 黄静[1] 龚雨兵[1] YIN Yutian;ZHENG Yi;HANG Jing;GONG Yubing(School of Mechanical and Electrical Engineering,Guilin University of Electronic Technology,Guilin 541004,China;Hongfeng Control Ltd.of Hubei Sanjiang Aerospace,Xiaogan 432000,China)

机构地区：[1]桂林电子科技大学机电工程学院,广西桂林541004 [2]湖北三江航天红峰控制有限公司,湖北孝感432000

出　　处：《桂林电子科技大学学报》2021年第1期68-73,共6页Journal of Guilin University of Electronic Technology

基　　金：国家国防科学基础研究项目(JSZL2018204B003)。

摘　　要：针对再流焊接工艺参数对焊点可靠性的影响问题,提出了一种基于响应面法的红外热风再流焊温度场影响因素及其规律的方法。该方法通过有限元分析软件对再流焊期间印制板组件温度场进行数值建模及仿真,获得温度分布;采用中心复合抽样设计,进行Kriging响应面拟合;利用局部灵敏度分析各个工艺参数对再流区温度曲线及其关键指标的影响。研究结果表明,对焊点可靠性影响最大的工艺参数为再流区的温度,PCBA传送速率的影响次之,升温区和保温区的温度影响较小,可为再流焊工艺设计提供参考和依据。In view of the influence of reflow welding process parameters on the reliability of solder joints,a research method based on response surface method is proposed to study the influence factors and rules of temperature field of infrared hot air reflow soldering.In this method,the temperature field of PCB assembly during reflow soldering is numerically modeled and simulated by finite element analysis software to obtain the temperature distribution;then the Kriging response surface is fitted by using the central composite sampling design;The local sensitivity was used to analyze the influence of each process parameter on the temperature curve and its key indexes;The research results show that the process parameter that has the greatest impact on the reliability of the solder joint is the temperature of the reflow zone,followed by the impact of the PCBA transfer rate.and the temperature of temperature rise zone and heat preservation zone has little influence;the research results can provide reference and basis for the design of reflow soldering process.

关 键 词：再流焊 温度场仿真 Kriging响应面 影响因素 影响规律 

分 类 号：TG156[金属学及工艺—热处理]