CQFP不同引线成型方式的板级组装可靠性分析  

Reliability Analysis of Board-level Assembly of Different Lead Forming Methods in CQFP Devices

作　　者：明雪飞 王剑峰 张振越 MING Xuefei;WANG Jianfeng;ZHANG Zhenyue(No.58 Research Institute of CETC,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所封装事业部,江苏无锡214035 [2]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2021年第3期53-57,共5页Electronic Product Reliability and Environmental Testing

摘　　要：陶瓷四边引脚扁平封装(CQFP)适用于表面贴装。由于陶瓷材料与PCB的杨氏模量、热膨胀系数等参数的差异,器件在力学振动、温度循环等过程中引线互联部分会产生应力应变累计,焊接处易产生裂纹而导致失效。针对以上情况,通过模态、随机振动和温循疲劳寿命3种分析方法,对比分析了两种不同引线成型方式器件板级组装的可靠性。仿真结果表明,二次成型引线器件的固有频率更低,引线上的最大应力从焊接区域转移至引线二次折弯处,并且二次成型引线器件的温循疲劳寿命更长。CQFP is suitable for surface mounting.Due to the difference in Young’s Modulus and thermal expansion coefficience between the ceramic material and the PCB,in the process of mechanical vibration and temperature cycling of the device,the lead interconnection will produce stress and strain accumulation,and the welding part is prone to cracks and lead to failure.In view of the above situation,through three analysis methods of modal,random vibration,and temperature cycle fatigue life,the reliability of the board-level assembly of the two different load forming methods is compared and analyzed.The simulation results show that the natural frequercy of the over-molded lead device is lower,the maximum stress on the lead is transferred from the welding area to the second bend of the lead,and the temperature cycle fatigue life of the over-molded lead device is longer.

关 键 词：四边引脚扁平封装 板级可靠性 温度循环 随机振动 

分 类 号：TB114.35[理学—概率论与数理统计] TP391.99[理学—数学]