一种毫米波BGA封装低成本测试方法  

A Low Cost Test Method for Millimeter Wave Ball Grid Array Package

作　　者：刘帅 张凯[1] LIU Shuai;ZHANG Kai(The 10th Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第十研究所,成都610036

出　　处：《微波学报》2021年第3期56-59,共4页Journal of Microwaves

摘　　要：提出一种可应用于毫米波BGA(Ball Grid Array)封装器件的低成本无损测试方法。该测试方案主要由毛纽扣及两块单层基板组成。其中,毛纽扣作为封装焊球与基板之间的垂直互联媒介,实现信号传输。同时,毛纽扣具有较小的弹性接触力,在测试过程中能够保护焊球不受损伤。毛纽扣与基板形成的介质填充类同轴结构和基板上的高低阻抗线共同参与阻抗匹配,通过电磁仿真软件HFSS优化可以在毫米波频段内实现良好的射频传输。最后,基于该方法,设计了一款可应用于Ka频段的测试座样件。实测结果表明,该测试座方案在21~33 GHz范围内实现端口互连回波损耗优于-14 dB。In this paper,a low cost non-destructive testing method for millimeter wave(MMW)ball grid array(BGA)package is proposed,which mainly consists of fuzz buttons and two single-layer substrates.In this structure,the fuzz button acts the vertical interconnecting medium between the solder ball and the substrate,and thus realizing signal transmission.Meanwhile,due to its small contact force,the fuzz button could protect the package ball during testing process.The dielectric filling coaxial structure,formed by the fuzz buttons and the substrate,and the high-low impedance lines on the substrate participate in impedance matching.By means of electromagnetic simulation software HFSS,a good transmission performance in MMW frequency band can be obtained.Finally,based on the framework discussed above,a sample socket is designed and fabricated for Ka band.The measurement shows that the port return loss is better than-14 dB in the operating frequency band of 21-33 GHz.

关 键 词：毫米波BGA封装 毛纽扣 基板 测试座 

分 类 号：TN405[电子电信—微电子学与固体电子学]