宽带射频SiP集成工艺IP建模仿真技术及应用  

Study and Application of Integrated Process IP Modeling and Simulation Technology in Broadband RF SiP

作　　者：李阳阳[1] 张晏铭 张继帆 董乐[1] 向伟玮[1] 徐榕青 LI Yang-yang;ZHANG Yan-ming;ZHANG Ji-fan;DONG Le;XIANG Wei-wei;XU Rong-qing(The 29^(th) Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《中国电子科学研究院学报》2021年第5期419-425,共7页Journal of China Academy of Electronics and Information Technology

摘　　要：宽带射频SiP中包含不同功能基板、金丝金带级联、射频类同轴互连等工艺传输单元,这些传输单元的结构要素及其工艺容差对组件的宽带性能影响较大,但在理想的射频链路仿真往往被忽略,导致实测与仿真设计值偏差较明显。针对此问题,文中通过电磁仿真优化、射频性能提参、神经网络建模及封装技术,开发了一批宽带微波集成工艺IP,并以一款宽带射频SiP产品为对象完成射频仿真与实测验证,结果表明,集成工艺IP在功能和性能上均满足精细化射频链路仿真设计的需求,可以明显提升微波电路设计与工艺的耦合度及仿真精度。The inner functional substrate transmission structure,wire bonded/ribbon bonded structure and RF coaxial transmission structures are frequently-used in Broadband RF SiP.The structural element and process deviation of these transmission units make contributions to broadband RF performance,how-ever,often ignored in RF link simulation,resulting in an obvious deflection between measured results and numerical simulation.In this paper,electromagnetic simulation optimization,RF performance characterization and neural network modelling&packaging technologies are used to develop a set of broadband RF integrated process IPs,which are applied in broadband RF link simulation.The results show that integrated process IPs can satisfied the demand for fine modelling and simulation in terms of function and performance,realizing efficient coupling between design and process in broadband microwave product and improving simulation accuracy evidently.

关 键 词：宽带射频 集成工艺建模 射频链路仿真 

分 类 号：TN850[电子电信—信息与通信工程] TN92