玻璃基三维集成技术在宽带射频领域的应用  

Application of the Glass Based 3D Integration Technology in Broadband RF Field

作　　者：卢茜[1] 张剑 王文博 董乐[1] 向伟玮[1] LU Qian;ZHANG Jian;WANG Wen-bo;DONG Le;XIANG Wei-wei(The 29^(th) Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《中国电子科学研究院学报》2021年第5期434-437,共4页Journal of China Academy of Electronics and Information Technology

基　　金：中国电科XX工程基金资助项目(JSXC2019XT008)。

摘　　要：玻璃材料具有良好的射频传输特性和可加工性,在先进封装领域获得广泛关注。文中针对宽带射频领域对于三维封装的需求,研究了玻璃转接板加工以及玻璃基三维堆叠工艺,测试了玻璃堆叠结构的射频性能。在此基础上将射频芯片嵌入在由玻璃转接板和转接框形成的空腔内,实现了两层射频链路的垂直堆叠,从而形成工作频率2 GHz~18 GHz的宽带玻璃基变频微模组,其测试性能与设计仿真一至,说明结构工艺路径可行,最后对玻璃封装技术的应用前景进行了展望。Glass material has the advantage of good RF transmission performance and good processability,which has attracted extensive attention in advanced packaging field.In this paper,the process of glass interposer and 3D interposer stacking were studied,then the RF performance of the glass stack structure was tested.Based on these,MMICs were embedded in the cavity formed by two glass interposers an a glass frame,which allowed the RF chains could be stacked.Finally,the 3D converter module,worked between 2-18 GHz was realized,the tested data were consistent with the design,which means the structure and technology are feasible,and in the later future applications were prospected.

关 键 词：玻璃转接板 三维堆叠 宽带射频 

分 类 号：TN405[电子电信—微电子学与固体电子学]