LTCC生瓷带基本性能检测方法研究  

Checkup Method Study of the Basic Characteristics of LTCC Green Tape

作　　者：何中伟[1] 王晓卫 李冉 高亮 HE Zhong-wei;WANG Xiao-wei;LI Ran;GAO Liang(Institute 214 of CNGC,Ltd.,Suzhou 215163,China;Shenzhen Zhenhua Microelectronics Co.,Ltd.,Shenzhen 518000,China)

机构地区：[1]中国兵器工业集团第214研究所,江苏苏州215163 [2]深圳市振华微电子有限公司,广东深圳518000

出　　处：《中国电子科学研究院学报》2021年第5期451-458,485,共9页Journal of China Academy of Electronics and Information Technology

摘　　要：在梳理归集LTCC生瓷带烧结前与烧结后的主要性能指标的基础上,总结了LTCC生瓷带产品的性能要求。说明了性能检测的条件。研究提出了LTCC生瓷带的表面质量及几何、力学、电学、热学相关的外形尺寸、表面粗糙度、平整度、尺寸稳定性、剥离强度、抗拉强度、抗弯强度、杨氏模量、密度、介电常数、损耗因子、体电阻率、热导率、热膨胀系数等重点性能指标检测的样品制备与方法步骤。所论述的检测方法具有很强的实用性和一定的平台关联性。On the basis of sorting out and collecting the main performance parameters of pre-firing and fired LTCC green tape,the characteristic requirements of LTCC green tape products were summed up.The characteristic checkup conditions were explained.The checkup sample preparation,method and steps of LTCC green tape’s surface quality and geometrical,mechanical,electrical,thermal key performance parameters such as outside dimensions,surface roughness,flatness,dimension stability,peel strength,tensile strength,bending strength,Young’s modulus,density,dielectric constant,dissipation factor,volume resistivity,coefficient of thermal conductivity,coefficient of thermal expension etc.were discussed and put forward.The expressed checkup methods are very practical and some platform correlative.

关 键 词：LTCC生瓷带 LTCC基板 性能指标 检测条件 检测方法 

分 类 号：TN604[电子电信—电路与系统]