倒装焊封装工艺缺陷及检测方法研究  

Research on Process Defect and Detection Methods of Flip Chip Package

作　　者：吕晓瑞 林鹏荣 刘建松 孔令松 

机构地区：[1]北京微电子技术研究所

出　　处：《信息技术与标准化》2021年第7期16-20,共5页Information Technology & Standardization

摘　　要：针对面阵列倒装焊封装结构内部互连工艺质量检测难度大的问题,提出了适用于倒装焊封装典型工艺缺陷的检测方法,阐述了光学二维视觉检测、X射线检测等常用缺陷检测技术的原理和工艺适用性,为倒装焊封装工艺质量提升提供有效技术参考。In view of the difficulty in the quality inspection of the internal interconnection process of the area array flip-chip package structure,the article proposes a detection method suitable for typical process defects of the flip-chip package.The principle and process applicability of common defect detection technologies such as optical inspection and X-ray inspection are described,which provides an effective technical reference for improving the quality of flip-chip packaging process.

关 键 词：倒装焊封装 凸点制备 芯片倒装 底部填充 缺陷检测 

分 类 号：TN405[电子电信—微电子学与固体电子学]