Recent developments of stamped planar micro-supercapacitors: Materials,fabrication and perspectives  

作　　者：Fei Li Yang Li Jiang Qu Jinhui Wang Vineeth Kumar Bandari Feng Zhu Oliver G.Schmidt 

机构地区：[1]Material Systems for Nanoelectronics,Chemnitz University of Technology,09107,Chemnitz,Germany [2]State Key Laboratory of Polymer Physics and Chemistry,Changchun Institute of Applied Chemistry,Chinese Academy of Sciences,130022,Changchun,China [3]Center for Materials,Architectures and Integration of Nanomembranes(MAIN),Chemnitz University of Technology,09126,Chemnitz,Germany [4]Institute for Integrative Nanosciences,Leibniz IFW Dresden,01069,Dresden,Germany [5]School of Science,Dresden University of Technology,01062,Dresden,Germany

出　　处：《Nano Materials Science》2021年第2期154-169,共16页纳米材料科学（英文版）

基　　金：the support and funding from China Scholarship Council(CSC);support by the Leibniz Program of the German Research Foundation(SCHM 1298/26-1)。

摘　　要：The rapid development of wearable and portable electronics has dramatically increased the application for miniaturized energy storage components.Stamping micro-supercapacitors(MSCs)with planar interdigital configurations are considered as a promising candidate to meet the requirements.In this review,recent progress of the different stamping materials and various stamping technologies are first discussed.The merits of each material,manufacturing process of each stamping method and the properties of stamping MSCs are scrutinized,respectively.Further insights on technical difficulties and scientific challenges are finally demonstrated,including the limited thickness of printed electrodes,poor overlay accuracy and printing resolution.

关 键 词：Microsupercapacitors STAMPING MICROFABRICATION Miniaturized electronics Energy storage devices 

分 类 号：TM53[电气工程—电器]