电镀软金用硫基无氰金配合物电解质研究进展  

Research progress of sulfur-based cyanide-free water-soluble gold complex electrolyte for electroplating soft gold

作　　者：阳岸恒 裴洪营 邓志明 朱勇 李安全 陈琳 YANG An-heng;PEI Hong-ying;DENG Zhi-ming;ZHU Yong;LI An-quan;CHEN Lin(State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Sino-Platinum Metals Co.Ltd.,Kunming 650106,China)

机构地区：[1]贵研铂业股份有限公司稀贵金属综合利用新技术国家重点实验室,昆明650106

出　　处：《贵金属》2021年第1期88-97,共10页Precious Metals

基　　金：云南省稀贵金属材料基因工程(202002AB080001-1);云南省基础研究计划青年项目(2019FD139);昆明市高层次人才引进工程创新类技术先进项目。

摘　　要：电镀金工艺中金氰化物([Au(CN)_(2)]-)溶液在过程中会释放出剧毒的游离氰化物离子,严重危害到生产人员和自然环境的健康;此外,它们还会对光刻胶造成一定的破坏。近年来无氰电解质得到了发展。基于对50余篇文献的分析,本文比较了亚硫酸金([Au(SO_(3))_(2)]^(3-))、硫代硫酸金([Au(S_(2)O_(3))_(2)]^(3-))和二者混合电解液,以及其他硫基体系的组成、操作条件、电沉积机理和优缺点,并展望了基于无氰配体电解液的软金电镀技术的研究趋势和发展方向。Gold cyanide([Au(CN)_(2)]-)solution releases free cyanide ions during plating process.The toxicity will seriously endanger the health of the production personnel and natural environment.In addition,they will cause certain damage to the photoresist.Therefore,cyanide-free electrolytes have been developed in recent years.Based on the analysis of more than 50 references,the composition,operating conditions,electrodeposition mechanism,advantages and disadvantages of various sulfite gold([Au(SO_(3))_(2)]^(3-)),thiosulfate gold([Au(S_(2)O_(3))_(2)]^(3-))and their mixed electrolytes,and other sulfur-based cyanide-free gold plating electrolyte systems were summarized.The research trend and development direction of soft gold electroplating technology based on cyanide-free ligand electrolyte were prospected.

关 键 词：电镀软金 无氰 亚硫酸金 硫代硫酸金 混合电解液 稳定剂 

分 类 号：TQ153.18[化学工程—电化学工业]