合金元素对Cu/Sn-/Cu回流焊焊点界面微观结构及剪切性能的影响  

Effects of Alloy Elements on Microstructure and Shearing Properties of Cu/Sn-/Cu Reflow Soldering Joints

作　　者：杨平 毛育青 李芊芃 何良刚 柯黎明 YANG Ping;MAO Yuqing;LI Qianpeng;HE Lianggang;KE Liming(Key Laboratory of Nondestructive Testing of Ministry of Education,Nanchang Hangkong University,Nanchang 330063,China;National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology,Nanchang Hangkong University,Nanchang 330063,China)

机构地区：[1]南昌航空大学无损检测技术教育部重点实验室,南昌330063 [2]南昌航空大学轻合金加工科学与技术国防重点学科实验室,南昌330063

出　　处：《材料导报》2021年第14期14156-14160,共5页Materials Reports

基　　金：无损检测技术教育部重点实验室开放基金(EW201703508)。

摘　　要：选用Sn64Bi 35Ag1、Sn64.7Bi35Ag0.3和Sn99Ag0.3Cu0.7三种不同的钎料进行回流焊焊接试验,研究高Bi元素、低Ag元素钎料及低Ag钎料对Sn基钎料焊点微观组织及剪切性能的影响。结果表明:各焊点界面处均生成了一层扇贝状的Cu_(6)Sn_(5)金属间化合物,在含Bi元素的钎料焊点中,Bi元素在焊点界面及内部聚集,导致界面处金属间化合物层的厚度增加,大量富Bi相呈脆性,降低钎料中的Ag含量对焊点中Bi元素的富集现象有减弱作用。Sn99Ag0.3Cu0.7钎料焊点界面处的金属间化合物层厚度最小,且焊点内部形成了细小的Ag_(3)Sn相颗粒,共晶组织呈均匀分布,使得焊点剪切性能最优,其剪切强度达20.4 MPa。Three different solders,Sn64Bi35Ag1,Sn64.7Bi35Ag0.3 and Sn99Ag0.3Cu0.7,were selected for the reflow welding test.The effects of high Bi,low Ag and low Ag solders on microstructure and tensile shear properties of Sn-based solder joints were investigated.The results show that a scallop-like Cu_(6)Sn_(5) intermetallic compound is formed at the interface of each solder joint.In the solder joint containing Bi,the accumulation of Bi at the interface and inside of the solder joint leads to the increase of the thickness of the intermetallic compound layer at the interface,and a large number of Bi-rich phases are brittle.The decrease of Ag content in the solder weakens the enrichment of Bi in the solder joint.The thickness of intermetallic compound layer at the interface of Sn99Ag0.3Cu0.7 solder joint is the smallest,and fine Ag_(3)Sn phase particles are formed in the solder joint.The eutectic structure is uniformly distributed,which makes the shear performance of the solder joint optimal,and the shear strength reaches 20.4 MPa.

关 键 词：合金元素 Sn基钎料 回流焊 显微组织 剪切性能 

分 类 号：TG453.9[金属学及工艺—焊接]