QFP封装元器件抗振性能分析及加固  

Analysis and Reinforcement of Anti-vibration Performance of QFP Packaged Components

作　　者：杨龙[1] 醋强一[1] 刘冰野[1] 齐文亮 YANG Long;CU Qiangyi;LIU Bingye;QI Wenliang(Aeronautical Computing Technique Research Institute,Xi’an 710068,China)

机构地区：[1]西安航空计算技术研究所,西安710068

出　　处：《机械工程师》2021年第8期33-35,共3页Mechanical Engineer

摘　　要：QFP封装的元器件被广泛的应用于机载电子设备中,而元器件手册中并不提供其能够承受的振动量值。文中以第四强度理论及米勒损伤累积理论为基础,以管腿材料的物理特性为判据,对元器件抗振性能进行分析。在寿命余量较小的情况下,采取加固方案并进行了热疲劳分析和振动强度分析,提高元器件的使用寿命。QFP packaged components are widely used in the airborne electronic equipment,and the component manual does not provide the amount of vibration that it can withstand.Based on the fourth strength theory and Miller damage accumulation theory,this paper analyzes the anti-vibration performance of components based on the physical characteristics of the tube leg material.In the case of a small life margin,a reinforcement plan is adopted,and thermal fatigue analysis and vibration strength analysis are carried out to improve the service life of components.

关 键 词：QFP 抗振性能 加固 机载电子设备 

分 类 号：TN602[电子电信—电路与系统]