5G通信发展使印制板导通孔走上主导地位  

The PCB vias come to the leading position with the development of 5G communication

作　　者：林金堵 Lin Jindu

机构地区：[1]不详

出　　处：《印制电路信息》2021年第7期17-20,共4页Printed Circuit Information

摘　　要：评述了高密度的微导通孔将越来越大地影响着高频(高速)化信号传输的完整性。采用飞秒激光打孔可以消除热传导烧伤形成的倒锥形孔和缺陷,制造出接近完美理想的导通孔,可明显地提高信号传输的完整性和稳定性。This paper reviews that high density micro via will affect the integrity of high frequency(high speed)signal transmission more and more.Using femtosecond laser drilling can eliminate the inverted cone holes and defects caused by heat conduction burn,and produce nearly perfect through holes,which can significantly improve the integrity and stability of signal transmission.

关 键 词：高频(高速)化 微导通孔 激光钻孔 热传导 飞秒激光 

分 类 号：TN41[电子电信—微电子学与固体电子学]