微波组件细间距金丝键合工艺的可靠性分析  

Reliability Analysis of Fine Pitch Wire Bonding for Microwave Modules

作　　者：井津域 刘德喜 史磊 景翠 尹蒙蒙 JING Jinyu;LIU Dexi;SHI Lei;JING Cui;YIN Mengmeng(Beijing Research Institute of Telemetry,Beijing 100094,China)

机构地区：[1]北京遥测技术研究所,北京100094

出　　处：《电子工艺技术》2021年第4期198-202,206,243,共7页Electronics Process Technology

基　　金：装备发展预研项目(2009ZYHW0019)。

摘　　要：细间距小尺寸的焊盘键合工艺是微波组件自动键合工艺面临的关键技术瓶颈。针对具体产品,分析了细间距小尺寸焊盘的球焊键合的工艺控制要点,提出了改进劈刀结构、改进焊线模式、优化工艺参数等方面的工艺优化手段,采用该优化方法后,焊接的可靠性和稳定性得到了很大的提高,达到了提升自动球焊键合质量和提高金丝键合工艺精度的目的。The pad bonding with fi ne pitch and microsize is one of the key technic that automatic bonding process of microwave module is facing.According to the specifi c products,outlines for process control of fi ne pitch and microsize ball bonding are analyzed,and some optimization methods has been put forward,which contain optimum design of bonding capillary,methods of bonding wire,and selection of bonding parameters.The results show that the reliability and the stability of wire bonding have been greatly improved after using the optimization methods.Meanwhile,the quality and process precision of wire bonding are improved signifi cantly.

关 键 词：金丝键合 细间距小尺寸 键合劈刀 键合参数 

分 类 号：TN405[电子电信—微电子学与固体电子学]