等离子清洗工艺在芯片键合前的应用  

The Application of Plasma Cleaning Process before Chip Bonding

作　　者：马良 刘肖斌 张志耀 MA Liang;LIU Xiaobin;ZHANG Zhiyao(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工艺技术》2021年第3期174-177,共4页Electronics Process Technology

摘　　要：等离子清洗工艺是应用于当代半导体、薄膜/厚膜电路等行业在元件封装前、芯片键合前的二次精密清洗工艺,清洗效果影响最终产品的质量。国内现有等离子清洗工艺存在清洗不均匀问题,针对这一问题,简单介绍了等离子清洗设备的基本原理,分析并介绍等离子体清洗工艺在芯片键合前的应用,并针对封装行业中的沾污问题提出了可行的解决方法。The plasma cleaning process is assistant process about precision cleaning in the industry of semiconductor,circuit of film,packaging of component,bonding of chip.The result of the plasma cleaning will be conclusive impact of finally quality of product.Existing the plasma cleaning process has some questions,such as cleaning product will be uniformity.For this question,the basic theory and method about the plasma cleaning machine is introduced,and the application of the plasma cleaning process before chip bonding is analyzed,and viable method for existing main question in the packaging industry is proposed.

关 键 词：等离子清洗 芯片 二次精密清洗 

分 类 号：TN605[电子电信—电路与系统]