A Novel Fabrication Method for Flexible SOI Substrate Based on Trench Refilling with Polydimethylsiloxane  

作　　者：ZHANG Cang-Hai YANG Yi WANG Yu-Feng ZHOU Chang-Jian SHU Yi TIAN He REN Tian-Ling 张沧海;杨轶;王宇峰;周长见;束逸;田禾;任天令(Institute of Microelectronics,Tsinghua University,Beijing 100084;Tsinghua National Laboratory for Information Science and Technology,Tsinghua University,Beijing 100084)

机构地区：[1]Institute of Microelectronics,Tsinghua University,Beijing 100084 [2]Tsinghua National Laboratory for Information Science and Technology,Tsinghua University,Beijing 100084

出　　处：《Chinese Physics Letters》2013年第8期118-121,共4页中国物理快报（英文版）

基　　金：Supported by the National Natural Science Foundation of China(61025021,60936002,and 61020106006);the National Key Project of Science and Technology(2011ZX02403-002).

摘　　要：Flexible arrays based on the flexible connection of double layers are demonstrated.Flexible sensor arrays are highly desired for many applications.Conventional flexible electronics are implemented by directly fabricating them on organic flexible substrates such as polyimide or polyethylene terephthalate,or forming on rigid substrates and then transferring them onto elastomeric substrates.For the first time,a novel process method based on trench refilling with polydimethylsiloxane to make flexible arrays is proposed.In this method,the sensors are directly fabricated on islands of the final bulk silicon.The performance of the sensor will not to be effected by bending and stretching operations.A one-dimensional flexible array shows good flexibility.Since the flexibility process is the last fabrication step,this method is compatible with many micro-electro-mechanical system fabrication technologies and has good yield.

关 键 词：TRENCH SOI STRETCHING 

分 类 号：TN3[电子电信—物理电子学]