回流焊冷却过程中LTCC基板的热力分析  

Thermal analysis of LTCC substrates during reflow cooling

作　　者：郑丹 王凯[1] 石伟[2] 郄旭亮 史家乐 Zheng Dan;Wang Kai;Shi Wei;Qie Xuliang;Shi Jiale(Xi’an University of Technology,Xi’an 710048,China;Xi’an Institute of Space Radio Technology,Xi’an 710199,China)

机构地区：[1]西安理工大学,西安710048 [2]西安空间无线电技术研究所,西安710199

出　　处：《焊接》2021年第5期20-24,64,共6页Welding & Joining

基　　金：西安空间无线电技术研究所委托研究项目(102-441220007)。

摘　　要：建立了某航天电子产品焊接组件冷却过程的有限元热分析模型,研究了硅铝管壳与铅锡焊料的热物理参数随温度变化的规律。以降低低温共烧陶瓷(LTCC)基板第一主应力为优化目标,采用正交试验法得到了优化的冷却工艺参数,在该工艺参数下对回流焊冷却过程进行了仿真和试验研究。结果表明,LTCC基板的整体变形表现为自基板底部向管壳内部凸起,与检测结果一致。LTCC基板第一主应力的最大值分布在基板的圆角处,但不足以引起裂纹。采用文中所提出的冷却工艺参数,可以有效提高LTCC基板的焊接质量。A finite element thermal analysis model of welded component for an aerospace electronic product was established in the cooling process,and the variation of the thermophysical parameters of the Si-Al shell and Pb-Sn solder with temperature was investigated.Taking the minimum first principal stress produced in LTCC substrate as the optimization object,the optimized cooling process parameters were obtained by the orthogonal test method.Simulation and experimental research on the reflow welding cooling process were carried out under the process parameters.The results showed that the overall deformation of LTCC substrate was a bulge from the bottom of the substrate to the inside of the shell,which was consistent with the inspected results.The maximum value of the first principal stress of LTCC substrate distributed at the corners of the substrate,but it was not big enough to cause crack.The welding quality of LTCC substrate could be effectively improved by the cooling process parameters proposed in this paper.

关 键 词：焊接组件 回流焊 正交试验法 低温共烧陶瓷基板 

分 类 号：TG404[金属学及工艺—焊接]