有机包覆抗硫化腐蚀的银键合丝研究  

Study of Organic-Coated Silver Bonding Wire with Anti-Sulfuration Corrosion

作　　者：徐豪杰 叶志镇[1] 潘新花[1] 薛子夜 赵义东 谢海涛 XU Haojie;YE Zhizhen;PAN Xinhua;XUE Ziye;ZHAO Yidong;XIE Haitao(School of Materizals Science and Engineering,Zhejiang University,Hangzhou 310000,China;Zhejiang Jiabo Technology Co.,Ltd.,Yueqing 325600,China)

机构地区：[1]浙江大学材料科学与工程学院,杭州310000 [2]浙江佳博科技股份有限公司,浙江乐清325600

出　　处：《电子与封装》2021年第8期48-52,共5页Electronics & Packaging

摘　　要：选取了纯银键合丝和有机包覆银键合丝,通过抗硫化腐蚀试验,分析对比其表面形貌、电学性能和键合性能。结果表明,表面包覆的有机膜有效减少了银键合丝表面由于Ag与S反应生成的Ag_(2)S,保障了银丝金属光泽和低电阻电学性能,保证了银丝在引线键合过程中的稳定性能,为解决银键合丝易硫化腐蚀的问题提供了可行性方案。A pure silver bonding wire and an organic-coated silver bonding wire is prepared,and their surface morphologies,electrical properties and bonding performances through anti-sulfuration corrosion test are analyzed.The result shows that the organic film coated on the surface of the silver bonding wire effectively reduces the Ag_(2)S generated by the reaction of Ag and S,guarantees the metallic luster and low resistance electrical properties of silver wire,and ensures the stabilization of bonding performances of silver wire during the wire bonding process.This work provides a feasible solution to solve the problem of sulfide corrosion of silver bonding wire.

关 键 词：银键合丝 有机包覆 抗硫化腐蚀 键合性能 

分 类 号：TN305.94[电子电信—物理电子学]