碲系玻璃组成对晶硅电池金属化接触界面的作用机制  

Mechanism of action of tellurium glass composition on silver paste metallization in crystalline silicon solar cells

作　　者：张佳伟 杨云霞[1] 袁晓[1] 李红波[1] 仝华[1] ZHANG Jiawei;YANG Yunxia;YUAN Xiao;LI Hongbo;TONG Hua(School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China)

机构地区：[1]华东理工大学材料科学与工程学院,上海200237

出　　处：《电子元件与材料》2021年第8期747-751,759,共6页Electronic Components And Materials

基　　金：中央高校基本科研业务费专项资金项目(JKVJ12001039)。

摘　　要：探讨了碲系玻璃组成在银浆应用中对晶硅电池金属化接触界面的影响。通过在TeO_(2)-PbO-Li_(2)O玻璃中引入Bi_(2)O_(3)、SiO_(2)和Na_(2)O组成,研究了玻璃热学性质的变化、银胶粒在界面玻璃相中的形成、玻璃相对硅表面的侵蚀、界面玻璃的电容和阻抗性质。研究结果表明,在降低接触电阻方面,Bi_(2)O_(3)和SiO_(2)使得硅表面保持较高的掺杂浓度;Bi_(2)O_(3)提高了接触界面中银胶粒的数量;SiO2和Na2 O使得生长出较小的银胶粒。然而,当玻璃中Na_(2)O的含量大于摩尔分数3%时,接触界面的载流子复合会随之增大,使得接触电阻变大。The effect of tellurium glass composition on the silver paste interface metallization process was explored for crystalline silicon(c-Si)cells.By adding Bi_(2)O_(3),SiO_(2)and Na_(2)O components to the TeO_(2)-PbO-Li_(2)O glass,the thermal properties of the glass,the formation of Ag colloidal particles in the interfacial glass phase,the erosion of glass to Si surface,and the capacitance and impedance properties of interface glass were studied.The results show that several factors affect the contact resistance.Bi_(2)O_(3)and SiO_(2)components keep Si surface a high doping concentration,Bi_(2)O_(3)increases the number of Ag colloids in the contact interface,and SiO_(2)and Na_(2)O lead to smaller Ag colloidal size.When the Na_(2)O content in the glass is greater than 3%(mole fraction),the carrier recombination in the contact interface increases,resulting in a larger contact resistance.

关 键 词：晶硅太阳能电池 玻璃 银浆 金属化 银硅接触界面 

分 类 号：TM241.1[一般工业技术—材料科学与工程]