一种采用不溶性阳极板的印制电路板酸性电镀铜技术  

An acid copper plating technology with insoluble anode

作　　者：李晓红 林章清 章晓冬 刘江波 Li Xiaohong;Lin Zhangqing;Zhang Xiaodong;Liu Jiangbo

机构地区：[1]广东天承科技股份有限公司,广东广州511300

出　　处：《印制电路信息》2021年第8期17-21,共5页Printed Circuit Information

摘　　要：文章介绍了一种采用不溶性阳极板的酸铜电镀技术,相较于传统的可溶性阳极酸性电镀铜技术,具有显著的优势。该技术采用氧化–还原电子对"溶铜"技术"溶解"纯铜粒以补充镀液中消耗的铜离子,铜源成品价格较低;避免传统磷铜阳极中释放出来的磷污染槽液,影响电镀效果;避免含磷废液的产生和排放,降低环保负担和健康风险;避免阳极析氧,降低有机添加剂的消耗量。搭配合适的添加剂组合物用于印制电路板(PCB)电镀,可获得光亮的铜镀层,其物理性质优良,镀液分散能力好,非常适合用于PCB电镀制程。This article introduces an acid copper plating technology with insoluble anode,possessing distinct advantages compared to conventional acid copper plating technology with soluble anode.This technology applies“copper dissolution”technology with oxidization-reduction electron pair to“dissolve”pure copper particles to supplement consumed copper ions in the plating process,which reduces the material cost of copper.This technology avoids phosphorus polluting plating bath and affects the electroplating effect as traditional Phosphor copper anode technology does.Fifthly,environmental burden and health risks are reduced thanks to no generation and discharge of phosphorus-containing waste.Finally,consumption of organic additives is low thanks to the fact that anode does not produce oxygen.With selected additive compositions,the technology is proved suitable to Printed Circuit Board(PCB)plating,producing bright copper deposit with excellent physical properties and high throwing power(TP).

关 键 词：酸性电镀铜 印制电路板 不溶性阳极 

分 类 号：TN41[电子电信—微电子学与固体电子学]