基于专利分析的芯片“卡脖子”问题研究  

Research on the“Bottle Neck”Problem of Chips Based on Patent Analysis

作　　者：姜迪 徐寅 陈长益 芮雯奕 JIANG Di;XU Yin;CHEN Changyi;RUI Wenyi(Jiangsu Institute of Scientific and Technical Information,Nanjing 210042;China Mobile Group Jiangsu Company Limited,Nanjing 210029)

机构地区：[1]江苏科学技术情报研究所,江苏南京210042 [2]移动集团江苏分公司,江苏南京210029

出　　处：《中国科技资源导刊》2021年第4期14-21,共8页China Science & Technology Resources Review

摘　　要：首先从我国芯片的产业现状和发展格局入手,梳理芯片产业链确定高端芯片制造的EUV光刻技术是生产芯片的“卡脖子”技术。然后分析EUV光刻技术领域的发展趋势、技术分布、竞争态势和专利布局。最后从专利视角挖掘我国大陆EUV光刻技术与发达国家/地区的技术发展差距,提出解决芯片“核芯”技术受制于人问题的对策建议,为相关部门研究制定突破高端芯片“卡脖子”问题的政策措施提供数据和决策参考。This article starts with the current status and development pattern of China’s chip industry,sorts out the“chuck neck”link in the chip industry chain,that is,high-end chip manufacturing equipment-EUV lithography machine,and then analyzes the development trend of EUV lithography technology,Technology distribution,competitive situation and patent layout through patents,after that explores the technological development gap between Chinese mainland EUV lithography technology and developed countries/regions from the perspective of patents,finally proposes countermeasures and suggestions to solve the problem of chip“core”technology being restricted by others,and provides data and decision-making reference for relevant departments to formulate breakthroughs in“chuck neck”problem of high-end chip,so this article has a certain practical significance.

关 键 词：芯片 极紫外光刻 产业发展 专利分析 国际专利分类号 

分 类 号：TN43[电子电信—微电子学与固体电子学]